Sysacom Electronic Circuits Conception Circuits Electroniques
Custom Electronic Circuits Systems Electronics Systems
Electronics
 
  Home
  Business Model
  Executive Team
  Products
  FAQ Working with Sysacom
  Fields of Application
  PCB Design
  Electronic Circuit Design
  DSP
  FPGA
  Motor Control
  Software
  Technical Due Diligence
  Application Notes
  Careers at Sysacom
  Partners
  Contact Us
         
Home > PCBDesign
Systems Development electronic circuit design
Printed Circuit Board Design

In order to accommodate semiconductor technology and components miniaturization, printed circuit boards are getting more and more sophisticated. Surface mount package technology, such as the BGA, requires a thorough understanding of the printed circuit board manufacturing process to ensure successful volume production. New requirements such as controlled line impedance and line length matching must be well implemented. We will support you in the design of rigid and flexible printed circuits from one to more than twenty layers.


Our team of printed circuit board design specialists is ready to carry out your next project. We carry a good deal of knowledge and experience, ensuring better products. We are willing to work over a short time frame when necessary to meet your tight schedule. We set teams up and manage work efficiently to deliver your next design just in time.

We invest in professional software tools such as PADS from Mentor Graphics, PROTEL DXP from Altium to support efficiently the most complex challenge and to stay ahead of competition. We own the high speed routing option for PADS allowing assisted routing as well as controlled and balanced impedance trace routing. We can also support you moving an old PCAD design to a newer platform like PADS or Protel.


We use many different technologies to solve your design challenge:

  • Single sided, double sided and multi-layer printed circuit boards (up to 20 layers).
  • Blind and buried via.
  • Surface mounted package as well as BGA and micro BGA.

Figure 5: Via hole terminology


We handle all sort of constraints such as:

Controlled impedance, balanced traces and signal integrity

High speed digital design requires trace impedance matching on long line to avoid edge reflexion and thus ringing. Traces shall have fixed impedance such as 40 to 100 ohms and termination shall be provided as well. Traces impedances are related to trace width, isolation material depth and permittivity. Layer stackup shall be properly made to allow proper impedance in various layers.

Differential signalling in either digital or analog circuit requires balanced lines to ensure that common mode noise, such as ground bounce, is properly rejected. Signal such as LVDS requires balanced and controlled impedance to provide high performances.

Signal integrity analysis provides means to simulate the signal propagation delay and ringing on various critical digital signals. That is a very useful method to get into confidence about the analysed PCB design. 


High frequency

We have expertise in RF PCB design. Our designers know the basic principles guiding the RF signal routing: The importance of the placement, the routing length, the fact that components must be placed in the signal flow direction.  


High voltage, High current

High voltage power supplies with output over some kilovolts requires very special consideration, surface resistivity and trace clearance. Other considerations come at high current: trace resistance is the main concern, but temperature elevation is also very important. In some cases, the solution is to use thicker copper such as 2 or more ounces per square feet.  


Switching power supplies (SMPS)

Switching mode power supplies cause many hurdles when the PCB parts' placement and layout are not clearly understood and well done. A SMPS contains voltage and current loops that have very high dV/dt and di/dt. The routing of the traces forming those loops is very critical. Ground plane is not an absolute cure. Instead consider current flow path and traces' resistance and inductance.


Reach most PCB manufacturers

We are well positioned to link your company with the printed circuits manufacture. We know their capabilities and requirements on GERBER files. The table below  lists the minimum and maximum limits of some features and capabilities. This table represents the broad range of capabilities from many manufacturers.  

Feature

Standard

Advanced

Cutting Edge

Trace width and spacing

0.008" (0.13mm)

0.005" (0.13mm)

0.003" (0.075mm)

Aspect ratio

1:4

1:8

1:17

Via

Through

Blind, buried

Blind, buried

Number of layers

12

20

60

Controlled impedance

15%

10%

5%

Minimum drilled hole size

0.018" (0,46mm)

0.008" (0,203mm)

0.004" (0.102mm)

Copper weight

1oz

1, 2 or 4oz

1/3 to 6oz


Our PCB DESIGNERS TEAM has a huge experience with the following software:

  • PADS LAYOUT (High Speed)
  • PROTEL DXP (ALTIUM)

 

We cover a broad range of application requirements from simple two-layer thru-hole technology to twelve-layer surface mounted printed circuit boards.






We also provide thermal analysis of your PCB working with one of our regional partner. This type of analysis will reveal hot spot and circuit section requiring improvement or more heat sinking and ventilation.

Let us show you our expertise in printed circuit board design; we sincerely believe you will give us all of your future work.

Do not hesitate to contact us for your next PCB design.
Request an Online PCB design quote .


Link to PCB manufacturers:

PCBexpress.ca provides quick-turn circuit board prototypes online,  including 2-6 layers in 1-4 days!  Boards are produced & shipped within Canada when ordered on  http://www.pcbexpress.ca

If you are a PCB manufacturer and would like to have your link there do not hesitate to contact us.


 
 
Home | Business Model | Executive team | Products | FAQ | Applications | PCB Design | Electronic Circuit Design | DSP | FPGA | Motor Control | Software | Technical Due Diligence | Application notes | Career | Partners | Contact Us
 
 
 
© Copyrights Sysacom R&D Inc. 1999-2008